Semiconductors Summary
Full Transcript
TSMC is reportedly accelerating its advanced packaging facility in Arizona, with plans to package its first processors as early as 2028, according to sources. This development is seen as a significant step towards producing 'all American' chips, which aligns with the ongoing efforts to bolster domestic semiconductor manufacturing capabilities.
In other news, AMD's upcoming Ryzen 7 9850X3D chip has been listed on Geekbench, showing higher single-core performance compared to the existing 9800X3D model, although it scored slightly lower in multi-core tests.
Furthermore, TSMC has highlighted a 4.2X efficiency gain over the last decade from its N7 to A14 fabrication processes, emphasizing advancements in chip technology that may influence future product developments.